Konstantin O. Petrosyants, Igor A. Kharitonov, Mikhail S. Tegin, "Multi-level Electro-Thermal Simulation of Power PCB Electronic Modules for Motor Driving," WSEAS Transactions on Circuits and Systems, vol. 22, pp. 126-134, 2023, DOI:10.37394/23201.2023.22.14
Konstantin O. Petrosyants, Igor A. Kharitonov, Mikhail S. Tegin. Multi-level Electro-Thermal Simulation of Power PCB Electronic Modules for Motor Driving.
WSEAS Transactions on Circuits and Systems. 2023;22:126-134. 10.37394/23201.2023.22.14
WSEAS Transactions on Circuits and Systems
Print ISSN: 1109-2734, E-ISSN: 2224-266X
Volume 22, 2023
Multi-level Electro-Thermal Simulation of Power PCB Electronic Modules for Motor Driving
Authors: , ,
Abstract: A scheme of automated multi-level electro-thermal modeling of power PCB modules using software
tools Comsol at the device construction level, SPICE tool at the circuit level, and Asonika-TM tool at board level
was proposed to improve the conventional design approach. The effectiveness of the proposed methodology is
demonstrated in the example of electro-thermal analysis of real power MOSFET driver circuit realized on PCB.
Keywords:
multi-level electro-thermal simulation, PCB power electronic module, SPICE simulation, COMSOL, ASONIKA-TM, junction temperature jumps, thermal network
Pages: 126-134 WSEAS Transactions on Circuits and Systems, ISSN / E-ISSN: 1109-2734 / 2224-266X, Volume 22, 2023, Art. #14 DOI: 10.37394/23201.2023.22.14
×
Citation Tools