WSEAS Transactions on Circuits and Systems
Print ISSN: 1109-2734, E-ISSN: 2224-266X
Volume 22, 2023
Multi-level Electro-Thermal Simulation of Power PCB Electronic Modules for Motor Driving
Authors: , ,
Abstract: A scheme of automated multi-level electro-thermal modeling of power PCB modules using software
tools Comsol at the device construction level, SPICE tool at the circuit level, and Asonika-TM tool at board level
was proposed to improve the conventional design approach. The effectiveness of the proposed methodology is
demonstrated in the example of electro-thermal analysis of real power MOSFET driver circuit realized on PCB.