International Journal of Applied Mathematics, Computational Science and Systems Engineering
E-ISSN: 2766-9823
Volume 3, 2021
Comparison of transient thermography methods for defect detecting in electronic components and modules
Author:
Abstract: The article examines different methods of transient thermography applied to analyze the faults and detection of hidden defects in electronic components and modules. A brief analysis of the methods and recommendations for their application is presented. A systematic approach to designing a transient thermographic measurement system for the detection and analysis of faults and hidden defects in electronic components and modules is developed. Some experimental results are shown.