WSEAS Transactions on Heat and Mass Transfer
Print ISSN: 1790-5044, E-ISSN: 2224-3461
Volume 11, 2016
Modeling and Simulation of Heat Transfer in Conduction-Convection Systems
Authors: , ,
Abstract: The use of cooling systems in electronics is an important part of their design to provide a correct functioning of the device and improve its lifespan by controlling the temperature and avoiding overheating that could be of risk and cause any damage. One alternative to reduce the temperature is to use heat sinks that distribute the heat along their length by conduction and convection. The mathematical model of this process is important for design purposes as it can give information of the temperature distribution along the rod and the chip surface. Additionally, the use of dynamic models helps to know the influence of several parameters that affect the transfer of heat in the device, for example in the case of having specific dimensions of the rod. The present research contributes to explain the mathematical model of cooling fins in transistors. Equations for the temperature distribution along the length of the rod and the chip surface were obtained and used for simulation purposes. Accordingly, the evaluation of the ratio between the real heat transfer rate from the fin and he ideal heat transfer rate was performed.
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Pages: 121-127
WSEAS Transactions on Heat and Mass Transfer, ISSN / E-ISSN: 1790-5044 / 2224-3461, Volume 11, 2016, Art. #14