Recently, the proportion of MI in the semiconductor indus-

try is growing rapidly due to the semiconductor yield issue.

It is important to develop, increase yield, and reduce time in

semiconductor process, and the key for this is MI. Thin-Flim

Metrology is a measurement equipment that is primarily used

in semiconductor casting processes during the MI process.

The Thi-Flim Metrology (thin film thickness measurement)

of the photolithographic to deposition process is one of the

most important element technologies because if the wafer

rithms linked to Vision/Elipsometer that can accurately specify

Wafer’s location are essential for the development of semicon-

ductor production processes and inspection of fine patterns

and limit stacks The Ellipsometer measures the change in

polarization state after reflection or transmission of light, and

the change in polarization state is measured It is a measuring

the technology is dependent on foreign products. Existing fine

pattern recognition methods were only able to align through

designated marks, but in this topic, we developed fine pattern

recognition-based align s/w through the form of repetitive

patterns. Previously, a separate space was needed for Fiducial

mark, but this study does not require a separate space for

Pattern Wafer x/y Auto Align System using Machine Vision

Pattern for semiconductor wafer measurement. The measurement of semiconductors is crucial for the

semiconductor industry, and the proposed model aims to improve the semiconductor production automation

process. The proposed system consists of three main components: the stage, the vision system, and the pattern

alignment algorithm. The stage includes theWafer holder, Ellipsometer, and controller, and plays a critical role

in aligning the X and Y axes of the Wafer to 100 mm/s after pattern analysis. The vision system captures high-

quality images of the Wafer and analyzes the patterns on the Wafer to detect any defects or deviations from the

standard. The pattern alignment algorithm uses the information obtained from the vision system to align the

Wafer accurately. The Auto align process is fully automated and does not require any user intervention. The

process operates in three major steps: selecting the Wafer Recipe, photographing the pattern of the designated

recipe, and executing the Auto align. The proposed system offers a comprehensive and automated solution for

Align If the pattern registration work to be a reference point

can be checked through UI/UX. The proposed model supports

various wafer pattern recipes and can be used for different

measurement processes without user intervention. The system

aims to improve semiconductor production processes and

increase productivity and profits for semiconductor companies.

The composition of this paper consists of five chapters as

huge number of applications compared to other equipment,

so there are various types of lipometers suitable for various

applications, mainly in research institutes and semiconductor

industries. Among the various types of hi1ps00e161 are Rotat-

ing Polarizer Elipsometry (RPE), Rotating Ana-lyzer Elipsom-

etry (RAE), and Rotating Compenser Elip-someryRCE (S).

Eipsometry has a process that must be done before making a

measurement. Because it is a light measurement technology,

cal component and the specimen to be measured, which is

called a18n.0ema. After alignment, optical components such

the position angle to be found increases accordingly. By

using the compen-sator, a phase delay compensation plate,

the experimental error that occurs when the reflected light

approaches linear polarization can be reduced, and since the

problem of the detector. In other words, it is elipsometry that

eliminates the shortcomings of RPE and PAE. However, the

calibra-tion process is much more complicated than RPE and

RAE because it is necessary to find the position angle of

various process processes [3]. Stacking patterns formed on

each layer vertically and continuously without missing the

correct position is called an overlay. Accurate alignment

techniques are required as one of the ways to increase overlay

values [4]. The problem of misalignment can be minimized

by increasing alignment technology that establishes the circuit

of the mask to be newly formed in the circuit formed on

the wafer and precisely adjusts the X and Y values. If the

position value to be devised when stacking circuits vertically

is an overlay, there is a critical dimension that horizontally

CD value should not vary depending on the location of the

wafer. In this way, the correction value should be calculated

from occurring on subsequent wafers. In addition, methods

and wafer Daegu hardening. In addition, equipment such as

wafer stage, plate stage, lens, etc., and various defective issues

in design can also affect the misseline problem. Alignment

is one of the machine vision technologies that uses camera

sensors to recognize and calibrate the position of alignment

marks. Machine vision systems use special optical devices to

camera, allowing the computer system to process and measure

various characteristics for decision making[5, 6]. Image and

image processing technologies capable of high resolution and

high accuracy are increasing, and recent deep learning imaging

using technologies such as image, lidar, ultrasound, and laser

video surveillance, human computer interaction, traffic pattern

and localization to cope with changes in the shape of the

approach for modeling discrete-time dynamic systems [3]. If

the dynamic and measurement functions are linear and the

algorithm, we introduce a binary pattern-based SBP model

consisting of several sets of SBPs. In addition, I proposed

a kernel-based similarity measurement between the two SBP

models for target localization. In addition, binary pattern-

based SBP models provide better identification in situations of

similar color regions or low illumination, where color-based

This paper proposes an Automatic Semiconductor Measure-

technology that aims to improve the semiconductor production

automation process. The measurement of semiconductors is a

The system configuration of the proposed model consists

of three main components. The first component is the stage,

want based on their specific requirements. Once the Wafer

Recipe has been selected, the system uses an Auto align

algorithm to photograph the pattern of the designated recipe.

to handle this variability and provide accurate and efficient

results. Overall, the proposed system offers a comprehensive

ing the alignment and measurement process, the system can

risk of errors and improving the overall productivity of the

tion, and the Wafer Recip that you want to measure using the

4.2 Configuring Layouts

4.3 Auto Align After Pattern Analysis and

Recognition (Model Implementation)

system. The second task is to develop iterative algorithms for

The proposed technology presents a promising solution for

achieving accurate alignment in a production setting while

marks, which are reference points used to align parts or com-

ponents. The process of placing and identifying these marks

friendly GUI, which allows for continuous validation of the

and efficient solution for achieving accurate alignment in a

accurately the method can align the objects, and the tact

time is a measure of how quickly the method can perform

approach for achieving accurate and efficient object alignment

method can have significant practical applications in various

model of plain Wafer using Vision to reproduce the complete